Aoi Machine SAKI BF-18D-P40 Automated Optical Inspection Smt AOI machine

The SAKI BF-18D-P40 AOI machine is an advanced automated optical inspection (AOI) equipment used in the electronics manufacturing industry for inspecting printed circuit boards (PCBs) after the soldering process. It offers a range of features and capabilities that ensure accurate and efficient inspection of component placement, solder joints, and other defects on PCBs.

1. High-Resolution Imaging: The BF-18D-P40 AOI machine utilizes high-resolution imaging technology to capture detailed images of the PCBs. It can capture images from different angles and perspectives, allowing for comprehensive inspection of component presence, polarity, and solder joint quality.
2. 3D Inspection: The machine incorporates a 3D inspection system that uses structured light or laser scanning to capture precise height and topographical information of the PCBs. This enables accurate detection of defects such as lifted leads, tombstones, and insufficient solder.
3. Component Verification: The AOI machine verifies the presence, alignment, and polarity of components on the PCB. It compares the detected components against the bill of materials (BOM) or reference data to ensure correct component placement.
4. Solder Joint Inspection: The machine inspects the quality of solder joints, including solder fillet, bridging, voids, and open/insufficient solder. It identifies and classifies defects based on predefined criteria and provides detailed inspection results.
5. Defect Detection: The BF-18D-P40 AOI machine detects various types of defects, including missing components, misalignment, incorrect orientation, solder defects, and foreign material presence. It flags and highlights these defects for further analysis and verification.
6. Programming Flexibility: The machine offers a flexible programming interface that allows operators to define inspection criteria, set up inspection regions, and customize inspection algorithms. This flexibility enables adaptation to different PCB designs and assembly requirements.

1. Setup: Ensure that the BF-18D-P40 AOI machine is properly installed and connected to the power supply. Calibrate the machine according to the manufacturer's guidelines to ensure accurate inspection results.
2. Programming: Use the machine's interface to set up inspection parameters, such as inspection regions, defect detection criteria, and inspection algorithms. Define the inspection requirements based on the PCB design and assembly process specifications.
3. Loading: Place the PCBs onto the inspection stage or conveyor system of the AOI machine. Ensure proper alignment and fixation to prevent any movement or misalignment during the inspection process.
4. Inspection: Initiate the inspection process using the machine's interface. The machine will automatically scan the PCBs, capturing images and collecting inspection data. Monitor the inspection results in real-time and identify any defects or deviations from the predefined specifications.
5. Defect Analysis: Analyze the inspection results using the machine's analysis tools. Review and classify the detected defects, and conduct further verification or rework as necessary. Use the machine's reporting features to generate detailed defect reports for analysis and documentation.
6. Data Management: Manage the inspection data and generate statistical reports to monitor the quality trends and identify areas for process improvement. Utilize the machine's data management features to store and retrieve inspection data for future reference.
7. Maintenance: Regularly clean the machine's imaging system, inspection stage, and conveyor system to ensure accurate and reliable performance. Follow the manufacturer's maintenance guidelines for any required calibration or component replacement.

The SAKI BF-18D-P40 AOI machine offers advanced capabilities for accurate and efficient inspection of PCBs in electronic manufacturing. By following the proper setup and usage instructions, it enables effective quality control and process optimization in the assembly process.